LOCTITE® ECCOBOND UF 3800

Features and Benefits

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LOCTITE ECCOBOND UF 3800, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
  • Reworkable
  • High Tg
  • Room temperature flow capability
  • Fast cure at moderate temperatures
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Documents and Downloads

Technical Data Sheet
LOCTITE® ECCOBOND UF 3800
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Technical Information

Coefficient of thermal expansion (CTE), Above Tg 188.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 52.0 ppm/°C
Cure schedule, @ 130.0 °C 8.0 min.
Glass transition temperature (Tg) 69.0 °C
Viscosity, Physica MCR100 @ 25.0 °C Spindle CP50-1 375.0 mPa·s (cP)