Henkel has developed a very low resistive ink which gives extremely good conductivity at relatively low temperatures. Learn about the ink properties and some of the applications where it can be used.

Author: Rudie Oldenzijl

In order to support the drive to flexible, printed electronics Henkel has developed a series of new, highly conductive silver inks. Main differentiator of the new inks compared to available inks is their very high electrical conductivity combined with high levels of flexibility. On the one hand, these inks open up new possibilities for printed electronic applications and on the other hand they offer the possibility to significantly reduce the total cost of ownership in existing print applications by reducing track width and/or height. Get involved now and find out more about these new, sustainable, high conductive flexible silver inks.

Author: Sharona Sente

As power electronic devices become more and more prevalent in different markets, the need for new materials to enable higher performance — while maintaining reliability — is gaining higher focus. The management of heat for these upcoming applications requires new designs and technologies.

Author: Giuseppe Caramella

The RoHS directive has been well-publicized but often not fully understood. This webinar provides updates on the requirements of the legislation and how, in light of the move to lead-free, electronics assembly professionals can achieve high reliability.

The webinar provides information on when to make the switch to Pb-free in the automotive and industrial markets, receive detailed reliability comparisons of SnPb versus Pb-free alloys, discussion of failure mechanisms and the limitations of SAC alloys, information on the distinction between a differentiation standard and high reliability and much, much more.

Author: Ian Wilding

Many electronic assemblies are exposed to extreme conditions, such as strong temperature swings, corrosive environmental media or high humidity. Nevertheless, these devices have to deliver the expected performance, despite difficult environmental conditions. While Henkel has various solutions in its portfolio for electronic component and assembly protection, one in particular is a special hotmelt used in the low pressure molding process.

These innovative hotmelts, which Henkel markets under the TECHNOMELT^® brand, have a broad range of uses and are now available for almost every application. With the low pressure molding process, it is possible not only to bond surfaces but also to provide protective encapsulation, even for small and delicate electronic components. Thanks to the use of renewable raw materials, hotmelts are more environmentally compatible than other products and are RoHS and WEEE-approved materials.

Once the hotmelts are in direct contact ...

Automotive electronics' technology continues to find new applications all around the vehicle. Electronic control units are often assembled using Electrically Conductive Adhesives (ECAs), where components are attached to noble metallized ceramic or HDI boards. The major limitation of ECAs has been their instability on common electronic metals, such as tin, which requires the use of expensive noble finished metallizations.

Henkel however, has developed a product that enables stable performance with 100 percent tin-terminated components under several challenging test conditions. Henkel's ECAs provide the benefit of lower processing temperatures compared to solder pastes. This enables bonding of temperature sensitive components to temperature sensitive substrates without damaging them.

Author: Cindy Doumen

Over the last years there was already an increased interest for underfill materials noticeable in the industrial markets due to the switch from Pb-containing to Pb-free solders. The relative brittleness of the Pb-free solder isn’t coping with the high mechanical forces (vibrations and shocks), humidity requirements and CTE mismatches induced by the harsh temperatures, resulting in solder fatigue. Besides this, applications coming from other markets are finding their way to the industrial areas like for instance the “infotainment” applications and surround view cameras in cars. These aren’t used to the harsher requirements resulting in unexpected failures. Using capillary underfill will help you to deal with the CTE mismatches, humidity and other contaminants to prevent these failures. This webinar will focus on the industrial market trends and requirements and how they relate to our product portfolio and research areas.

Author: Stieven Josso

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference (EMI). Radio-frequency (RF) emitting devices require effective isolation to limit the propagation of their interference to neighboring components to protect the end device from performance degradation.

As electronics move toward miniaturization, lighter weight, and higher speeds, these challenges become more significant as conventional shielding methods present functional and operational limitations. To address this, the Faraday cage is applied directly at the package level.

This webinar will cover Henkel’s latest materials, application process, test methods, and performance.

Authors: Jinu Choi, Xinpei Cao, Dan Maslyk