Unsere Events und Webinare

LOCTITE Universal-Strukturklebstoffe

Mit nur 2 Klebstoffen können Sie fast all Ihre Klebeanforderungen erfüllen! Kleben Sie Materialien mit unterschiedlichen Eigenschaften, führen Sie schneller mehr Reparaturen durch, setzen Sie Ihren Designvorstellungen keine Grenzen mehr! Erfahren Sie mehr in einem unserer Webinare, unseren Live Demos und anderen Events.

Neue Fachschulungen der Henkel PSA Academy

Henkel bietet ein umfassendes Schulungsangebot für Fachleute an, die mit Haftschmelzklebstoffen arbeiten. Die Kurse richten sich dabei an Mitarbeiter von Klebeband- und Etikettenherstellern oder -druckereien sowie Herstellern von Spezialprodukten auf Basis von Haftschmelzklebstoff.

Die Bewertung von beschichtetem Material im praktischen Teil der Schulung bei der PSA Academy

High-Performance Conductive Film Technology for Large Die Automotive Applications: MSL and Board-Level Exposed Pad Performance

This article will focus on reliability testing for conductive Die Attach Film (cDAF) technology, specifically on die applications ranging from 1x1 mm2 to 10x10 mm2.

Low Temperature and Dual (UV) Cure Adhesives for Temperature Sensitive Electronic Applications

With the trend towards sensing functionalities, the number of semiconductor-based sensors is growing fast. Such sensors often contain temperature sensitive substrates and components (like MEMS), which limit the processing of thermally-cured adhesives and encapsulants to maximum 80°C. Next to this, more accurate sensing also requires low stress and low warpage adhesives for constant and stable functionality over operating temperature range. This webinar presents new materials for MEMS, CMOS image and fingerprint sensor type assemblies fulfilling such requirements.

Author: Ing. Ruud de Wit

EMI Shielding Solutions for Semiconductor Packages

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference (EMI). Radio-frequency (RF) emitting devices require effective isolation to limit the propagation of their interference to neighboring components to protect the end device from performance degradation.

As electronics move toward miniaturization, lighter weight, and higher speeds, these challenges become more significant as conventional shielding methods present functional and operational limitations. To address this, the Faraday cage is applied directly at the package level.

This webinar will cover Henkel’s latest materials, application process, test methods, and performance.

Authors: Jinu Choi, Xinpei Cao, Dan Maslyk

Webinar: Henkel Develops Advanced Solder Paste Test Vehicle

Webinar discussing Henkel's new test vehicle, and how it addresses miniaturization realities.

Underfill Solutions for Industrial Applications

Over the last years there was already an increased interest for underfill materials noticeable in the industrial markets due to the switch from Pb-containing to Pb-free solders. The relative brittleness of the Pb-free solder isn’t coping with the high mechanical forces (vibrations and shocks), humidity requirements and CTE mismatches induced by the harsh temperatures, resulting in solder fatigue. Besides this, applications coming from other markets are finding their way to the industrial areas like for instance the “infotainment” applications and surround view cameras in cars. These aren’t used to the harsher requirements resulting in unexpected failures. Using capillary underfill will help you to deal with the CTE mismatches, humidity and other contaminants to prevent these failures. This webinar will focus on the industrial market trends and requirements and how they relate to our product portfolio and research areas.

Author: Stieven Josso

Thermally Conductive "cure in place" Gap Filler as an Optimal Thermal Materials Solution for Highly Effective Cooling of Electronics

Effective thermal management is key to ensuring consistent performance and long-term reliability of many electronic devices. With the wide variety of applications requiring thermal management, the need for alternative thermal material solutions and innovative material placement methods continues to grow. In response, Bergquist and Henkel have developed and supply a variety of highly efficient, flexible and easy to handle thermally conductive interface materials to meet current and future needs for effectively cooling electronic systems ensuring long-term reliability.

One of those materials are Polymer-based dispensable Gap Fillers with unique characteristics especially designed for ultimate thermal management design and component assembly flexibility. Thermally conductive cure-in-place liquid Gap Fillers are an alternate to classical Pads that dispense efficiently, have high thermal performance as well as can be fully automated in processing.

Author: Holger Schuh

Thermal Interface Materials - Novel Solutions for Power Electronics and Heat Management in Handheld Devices

As power electronic devices become more and more prevalent in different markets, the need for new materials to enable higher performance — while maintaining reliability — is gaining higher focus. The management of heat for these upcoming applications requires new designs and technologies.

Author: Giuseppe Caramella