BERGQUIST® GAP FILLER TGF 1000

Poznat kao Gap Filler 1000

Elementi i pogodnosti

BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
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Tehnički podaci

Dielektrična konstanta, @ 1kHz 5.0
Gustina 1.6 g/cm³
Odnos mešanja po težini 1 : 1
Odnos mešanja po zapremini 1 : 1
Otpornost na plamen V-0
Raspored polimerizacije, @ 100.0 °C 5.0 minuta
Raspored polimerizacije, @ 25.0 °C 60.0 - 120.0 minuta
Temperatura čuvanja 25.0 °C
Toplotna provodljivost 1.0 W/mK
Toplotni kapacitet, ASTM E1269 1.0 J/g-K
Tvrdoća po Šoru, Thirty second delay value, ASTM D2240 Shore 00 30.0
Vek trajanja 6.0 mesec
Vek trajanja nakon otvaranja, @ 25.0 °C 15.0 minuta
Zapreminska otpornost 1×10 Ohm m
Učvršćivač
Boja, Učvršćivač Bela
Smola
Boja, Smola Siva