BERGQUIST® GAP FILLER TGF 1000
Tuntud kui Gap Filler 1000
Omadused ja eelised
BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
Lugege rohkem
Dokumendid ja allalaadimised
Otsite TDS-i või SDS-i teises keeles?
Tehniline teave
| Arvestuslik leegikindlus | V-0 |
| Dielektriline konstant, @ 1kHz | 5.0 |
| Kasutusaeg, @ 25.0 °C | 15.0 minut |
| Kõlblikkusaeg | 6.0 kuu |
| Kõvenemisaeg, @ 100.0 °C | 5.0 minut |
| Kõvenemisaeg, @ 25.0 °C | 60.0 - 120.0 minut |
| Mahu resistiivsus | 1×10 Ohm m |
| Seguvahekord, mahu järgi | 1 : 1 |
| Seguvahekord, massi järgi | 1 : 1 |
| Shore’i kõvadus, Thirty second delay value, ASTM D2240 Shore 00 | 30.0 |
| Soojusjuhtivus | 1.0 W/mK |
| Soojusmahtuvus, ASTM E1269 | 1.0 J/g-K |
| Säilitustemperatuur | 25.0 °C |
| Tihedus | 1.6 g/cm³ |
| Vaik | |
| Värvus, Vaik | Hall |
| Tugevdaja | |
| Värvus, Tugevdaja | Valge |
BERGQUIST® GAP FILLER TGF 1000
BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.