BERGQUIST® GAP FILLER TGF 1000

Bekend als Gap Filler 1000

Kenmerken en voordelen

BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
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Technische informatie

Dichtheid 1.6 g/cm³
Diëlektrische constante, @ 1kHz 5.0
Houdbaarheid 6.0 maand
Mengverhouding, per gewicht 1 : 1
Mengverhouding, per volume 1 : 1
Opslagtemperatuur 25.0 °C
Shore hardheid, Thirty second delay value, ASTM D2240 Shore 00 30.0
Thermische geleidbaarheid 1.0 W/mK
Uithardingsschema, @ 100.0 °C 5.0 min.
Uithardingsschema, @ 25.0 °C 60.0 - 120.0 min.
Verwerkingstijd, @ 25.0 °C 15.0 min.
Vlammenclassificatie V-0
Volumeweerstandsvermogen 1×10 Ohm m
Warmtecapaciteit, ASTM E1269 1.0 J/g-K
Verharder
Kleur, Verharder Wit
Hars
Kleur, Hars Grijs