BERGQUIST® GAP FILLER TGF 1000
Poznano kot Gap Filler 1000
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BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
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Tehnične informacije
| Dielektrična konstanta, @ 1kHz | 5.0 |
| Gostota | 1.6 g/cm³ |
| Ocena plamena | V-0 |
| Prostorninska upornost | 1×10 Ohm m |
| Razmerje mešanice, glede na težo | 1 : 1 |
| Razmerje mešanja, glede na prostornino | 1 : 1 |
| Rok uporabnosti | 6.0 meseci |
| Temperatura skladiščenja | 25.0 °C |
| Toplotna prevodnost | 1.0 W/mK |
| Toplotna zmogljivost, ASTM E1269 | 1.0 J/g-K |
| Trdota po Shoru, Thirty second delay value, ASTM D2240 Shore 00 | 30.0 |
| Urnik strjevanja, @ 100.0 °C | 5.0 min. |
| Urnik strjevanja, @ 25.0 °C | 60.0 - 120.0 min. |
| Čas uporabnosti, @ 25.0 °C | 15.0 min. |
| Trdilec | |
| Barva, Trdilec | Bela |
| Smola | |
| Barva, Smola | Siva |
BERGQUIST® GAP FILLER TGF 1000
BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.