BERGQUIST® GAP FILLER TGF 1000
Žinoma kaip Gap Filler 1000
Savybės ir privalumai
BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
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Techniniai duomenys
| Derva | |
| Spalva, Derva | Pilka |
| Dielektrinė konstanta, @ 1kHz | 5.0 |
| Galiojimo laikas | 6.0 mėn. |
| Kietėjimo planas, @ 100.0 °C | 5.0 min. |
| Kietėjimo planas, @ 25.0 °C | 60.0 - 120.0 min. |
| Laikymo temperatūra | 25.0 °C |
| Liepsnos įvertinimas | V-0 |
| Mišinio santykis pagal svorį | 1 : 1 |
| Mišinio santykis pagal tūrį | 1 : 1 |
| Tankis | 1.6 g/cm³ |
| Tinkamumo naudoti trukmė, @ 25.0 °C | 15.0 min. |
| Tūrio varža | 1×10 Ohm m |
| Šilumos laidumas | 1.0 W/mK |
| Šilumos talpa, ASTM E1269 | 1.0 J/g-K |
| „Shore“ kietumas, Thirty second delay value, ASTM D2240 Shore 00 | 30.0 |
| Kietiklis | |
| Spalva, Kietiklis | Balta |
BERGQUIST® GAP FILLER TGF 1000
BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.