BERGQUIST® GAP PAD® TGP 2000
Known as Gap Pad® 2000S40
Features and Benefits
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.
The highly conformable nature of BERGQUIST® GAP PAD TGP 2000 means the pad can fill air voids and air gaps with stepped topography, rough surfaces, and high stack-up tolerances. It has inherent natural tack on both sides of the material, allowing for stick-in-place characteristics during application assembly. It’s supplied with protective liners on both sides, and the top side has reduced tack for ease of handling.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Additional Documents
Technical Information
| Color | Gray |
| Density | 2.9 g/cm³ |
| Dielectric breakdown voltage | 5000.0 Vac |
| Dielectric constant, @ 1kHz | 6.0 |
| Flame rating | V-0 |
| Heat capacity, ASTM E1269 | 0.6 J/g-K |
| Operating temperature | -60.0 - 200.0 °C |
| Shore hardness, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00 | 30.0 |
| Standard thickness | 0.508 - 3.175 mm |
| Thermal conductivity | 2.0 W/mK |
| Volume resistivity | 1×10 Ohm m |
BERGQUIST® GAP PAD® TGP 2000
This silicone based, highly conformable, reinforced "S-Class" gap filling material is recommended for low-stress applications that require a mid to high thermally conductive interface material.