BERGQUIST® GAP PAD® TGP 5000
Conosciuto come Gap Pad® 5000S35
Caratteristiche e vantaggi
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Informazioni tecniche
Capacità termiche, ASTM E1269 | 1.0 J/g-K |
Classe di infiammabilità | V-0 |
Colore | Verde chiaro |
Conducibilità termica | 5.0 W/mK |
Costante dielettrica, @ 1kHz | 7.5 |
Densità | 3.6 g/cm³ |
Durezza shore, Thirty second delay value, ASTM D2240 Gomma bulk Shore 00 | 35.0 |
Resistività di volume | 1×10 Ohm m |
Spessore standard | 0.508 - 3.175 mm |
Temperatura di esercizio | -60.0 - 200.0 °C |
Tensione rottura dielettrica | 5000.0 Vac |