BERGQUIST® GAP PAD® TGP 5000
U svojstvu Gap Pad® 5000S35
Značajke i prednosti
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Dokumenti i preuzimanja
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Tehnički podaci
Boja | Svjetlozelena |
Dielektrična konstanta, @ 1kHz | 7.5 |
Dielektrični probojni napon | 5000.0 Vac |
Gustoća | 3.6 g/cm³ |
Jakost plamena | V-0 |
Otpornost volumena | 1×10 Ohm m |
Radna temperatura | -60.0 - 200.0 °C |
Toplinska vodljivost | 5.0 W/mK |
Toplinski kapacitet, ASTM E1269 | 1.0 J/g-K |
Tvrdoća prema Shoreu, Thirty second delay value, ASTM D2240 Sipki gumeni materijal Shore 00 | 35.0 |
Uobičajena debljina | 0.508 - 3.175 mm |