BERGQUIST® GAP PAD® TGP 5000
Cunoscut ca Gap Pad® 5000S35
Funcții și beneficii
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Informații tehnice
| Capacitatea termică, ASTM E1269 | 1.0 J/g-K |
| Conductivitatea termică | 5.0 W/mK |
| Constantă dielectrică, @ 1kHz | 7.5 |
| Culoare | Verde deschis |
| Densitate | 3.6 g/cm³ |
| Duritate Shore, Thirty second delay value, ASTM D2240 Cauciuc vrac Shore 00 | 35.0 |
| Evaluare flacără | V-0 |
| Grosimea standard | 0.508 - 3.175 mm |
| Rezistivitatea de volum | 1×10 Ohm m |
| Temperatura de funcționare | -60.0 - 200.0 °C |
| Tensiunea de străpungere dielectrică | 5000.0 Vac |
BERGQUIST® GAP PAD® TGP 5000
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.