BERGQUIST® GAP PAD® TGP 5000

Poznano kot Gap Pad® 5000S35

Lastnosti in prednosti

Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Tehnične informacije

Barva Svetlo zelena
Delovna temperatura -60.0 - 200.0 °C
Dielektrična konstanta, @ 1kHz 7.5
Gostota 3.6 g/cm³
Napetost dielektrične razgradnje 5000.0 Vac
Ocena plamena V-0
Prostorninska upornost 1×10 Ohm m
Standardna debelina 0.508 - 3.175 mm
Toplotna prevodnost 5.0 W/mK
Toplotna zmogljivost, ASTM E1269 1.0 J/g-K
Trdota po Shoru, Thirty second delay value, ASTM D2240 Razsuta guma Shore 00 35.0