BERGQUIST® GAP PAD® TGP 5000
Conhecido como Gap Pad® 5000S35
Características e Vantagens
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Informação Técnica
| Capacidade de calor, ASTM E1269 | 1.0 J/g-K |
| Classificação da chama | V-0 |
| Condutividade térmica | 5.0 W/mK |
| Constante dielétrica, @ 1kHz | 7.5 |
| Cor | Verde claro |
| Densidade | 3.6 g/cm³ |
| Dureza shore, Thirty second delay value, ASTM D2240 Borracha à granel Shore 00 | 35.0 |
| Espessura padrão | 0.508 - 3.175 mm |
| Resistividade volumétrica | 1×10 Ohm m |
| Temperatura de operação | -60.0 - 200.0 °C |
| Tensão de ruptura dieléctrica | 5000.0 Vac |
BERGQUIST® GAP PAD® TGP 5000
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.