BERGQUIST® GAP PAD® TGP 5000
Znany jako Gap Pad® 5000S35
Właściwości i korzyści
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Informacje techniczne
| Grubość standardowa | 0.508 - 3.175 mm |
| Gęstość | 3.6 g/cm³ |
| Klasa palności | V-0 |
| Kolor | Jasnozielony |
| Napięcie przebicia dielektrycznego | 5000.0 Vac |
| Pojemność cieplna, ASTM E1269 | 1.0 J/g-K |
| Przewodność cieplna | 5.0 W/mK |
| Rezystywność skośna | 1×10 Ohm m |
| Stała dielektryczna, @ 1kHz | 7.5 |
| Temperatura robocza | -60.0 - 200.0 °C |
| Twardość według Shore'a, Thirty second delay value, ASTM D2240 Guma luzem Shore 00 | 35.0 |
BERGQUIST® GAP PAD® TGP 5000
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.