BERGQUIST® GAP PAD® TGP 5000
Şöyle bilinir Gap Pad® 5000S35
Özellikleri ve Faydaları
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
Daha fazlasını okuyun
Dokümanlar ve İndirilebilir Belgeler
Başka bir dilde bir TDS veya SDS mi arıyorsunuz?
Teknik Bilgi
Dielektrik sabiti, @ 1kHz | 7.5 |
Dielektrik Çökümü Voltajı | 5000.0 Vac |
Hacim Özdirenci | 1×10 Ohm m |
Isı Kapasitesi, ASTM E1269 | 1.0 J/g-K |
Isı İletkenliği | 5.0 W/mK |
Renk | Açık Yeşil |
Shore Sertliği, Thirty second delay value, ASTM D2240 Kitle Kauçuk Shore 00 | 35.0 |
Standart Kalınlık | 0.508 - 3.175 mm |
Yanma Hızı | V-0 |
Yoğunluk | 3.6 g/cm³ |
Çalışma Sıcaklığı | -60.0 - 200.0 °C |