BERGQUIST® GAP PAD® TGP 5000

Poznat kao Gap Pad® 5000S35

Elementi i pogodnosti

Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Tehnički podaci

Boja Svetlo zelena
Dielektrična konstanta, @ 1kHz 7.5
Dielektrični proboj napona 5000.0 Vac
Gustina 3.6 g/cm³
Otpornost na plamen V-0
Radna temperatura -60.0 - 200.0 °C
Standardna debljina 0.508 - 3.175 mm
Toplotna provodljivost 5.0 W/mK
Toplotni kapacitet, ASTM E1269 1.0 J/g-K
Tvrdoća po Šoru, Thirty second delay value, ASTM D2240 Guma u komadu Shore 00 35.0
Zapreminska otpornost 1×10 Ohm m