BERGQUIST® GAP PAD® TGP 5000

Zināms kā Gap Pad® 5000S35

Iezīmes un ieguvumi

Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
Apraksts

Tehniskā informācija

Blīvums 3.6 g/cm³
Cietība, Thirty second delay value, ASTM D2240 Lielgabarīta gumija Shore 00 35.0
Darbības temperatūra -60.0 - 200.0 °C
Dielektriskā konstante, @ 1kHz 7.5
Dielektriskā sadalījuma spriegums 5000.0 Vac
Krāsa Pelēks
Liesmas novērtējums V-0
Siltuma jauda, ASTM E1269 1.0 J/g-K
Siltumvadītspēja 5.0 W/mK
Standarta biezums 0.508 - 3.175 mm
Tilpuma pretestība 1×10 Ohm m