BERGQUIST® GAP PAD® TGP 5000

Известен като Gap Pad® 5000S35

Характеристики и ползи

Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
Описание

Техническа информация

Диелектрична константа, @ 1kHz 7.5
Класификация на запалимостта V-0
Обемно съпротивление 1×10 Ohm m
Плътност 3.6 g/cm³
Пробивно напрежение на диелектрика 5000.0 Vac
Работна температура -60.0 - 200.0 °C
Стандартна дебелина 0.508 - 3.175 mm
Твърдост по Шор, Thirty second delay value, ASTM D2240 Гума в насипно състояние Shore 00 35.0
Топлоемкост, ASTM E1269 1.0 J/g-K
Топлопроводност 5.0 W/mK
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