LOCTITE® ABLESTIK ABP 8420
Caratteristiche e vantaggi
LOCTITE ABLESTIK ABP 8420, Epoxy, Die Attach, Non-Conductive Adhesive
LOCTITE® ABLESTIK ABP 8420 non-conductive adhesive is designed for cap, lid attach applications in wirebond packages. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. LOCTITE ABLESTIK ABP 8420 will cure at temperatures as low as 80ºC in conventional box or convection conveyor oven curing. If used over an active die face, an adhesive bondline thickness of >1 mil must be maintained to prevent die scarring.
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Informazioni tecniche
| Applicazioni | Die attach |
| Coefficiente di espansione termica (CTE) | 54.0 ppm/°C |
| Coefficiente di espansione termica (CTE), Above Tg | 154.0 ppm/°C |
| Conducibilità termica | 0.3 W/mK |
| Indice tixotropico | 5.8 |
| Temperatura di transizione vetrosa (Tg) | 75.0 °C |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
| Viscosità, Brookfield CP51, @ 25.0 Speed 5 rpm | 13500.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8420
LOCTITE ABLESTIK ABP 8420, Epoxy, Die Attach, Non-Conductive Adhesive