LOCTITE® ABLESTIK ABP 8420
功能與優點
LOCTITE ABLESTIK ABP 8420, Epoxy, Die Attach, Non-Conductive Adhesive
LOCTITE® ABLESTIK ABP 8420 non-conductive adhesive is designed for cap, lid attach applications in wirebond packages. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. LOCTITE ABLESTIK ABP 8420 will cure at temperatures as low as 80ºC in conventional box or convection conveyor oven curing. If used over an active die face, an adhesive bondline thickness of >1 mil must be maintained to prevent die scarring.
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技術資訊
固化類型 | 熱固化 |
導熱性 | 0.3 W/mK |
應用 | 晶片焊接 |
熱膨脹係數 (CTE) | 54.0 ppm/°C |
熱膨脹係數 (CTE), Above Tg | 154.0 ppm/°C |
玻璃化溫度(Tg) | 75.0 °C |
粘度,Brookfield CP51, @ 25.0 Speed 5 rpm | 13500.0 mPa.s (cP) |
觸變指數 | 5.8 |