LOCTITE® ABLESTIK ABP 8420
Vlastnosti a výhody
LOCTITE ABLESTIK ABP 8420, Epoxy, Die Attach, Non-Conductive Adhesive
LOCTITE® ABLESTIK ABP 8420 non-conductive adhesive is designed for cap, lid attach applications in wirebond packages. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. LOCTITE ABLESTIK ABP 8420 will cure at temperatures as low as 80ºC in conventional box or convection conveyor oven curing. If used over an active die face, an adhesive bondline thickness of >1 mil must be maintained to prevent die scarring.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
Aplikácia | Pripevnenie formy |
Koeficient tepelnej rozťažnosti (CTE) | 54.0 ppm/°C |
Koeficient tepelnej rozťažnosti (CTE), Above Tg | 154.0 ppm/°C |
Spôsob vytvrdzovania | Vytvrdzovanie teplom |
Tepelná vodivosť | 0.3 W/mK |
Teplota priepustnosti skla (Tg) | 75.0 °C |
Tixotropný index | 5.8 |
Viskozita, Brookfield CP51, @ 25.0 Speed 5 rpm | 13500.0 mPa.s (cP) |