LOCTITE® ABLESTIK ABP 8420

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LOCTITE ABLESTIK ABP 8420, Epoxy, Die Attach, Non-Conductive Adhesive
LOCTITE® ABLESTIK ABP 8420 non-conductive adhesive is designed for cap, lid attach applications in wirebond packages. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. LOCTITE ABLESTIK ABP 8420 will cure at temperatures as low as 80ºC in conventional box or convection conveyor oven curing. If used over an active die face, an adhesive bondline thickness of >1 mil must be maintained to prevent die scarring.
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Tehniline andmeleht
LOCTITE® ABLESTIK ABP 8420
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Tehniline teave

Klaasistumistemperatuur (Tg) 75.0 °C
Rakendused Stantskinnitus
Soojusjuhtivus 0.3 W/mK
Soojuspaisumise koefitsient (CTE) 54.0 ppm/°C
Soojuspaisumise koefitsient (CTE), Above Tg 154.0 ppm/°C
Tahkumistüüp Kuumkõvenemine
Tiksotroopne indeks 5.8
Viskoossus, Brookfield CP51, @ 25.0 Speed 5 rpm 13500.0 mPa.s (cP)