LOCTITE® ABLESTIK 8-2
Caratteristiche e vantaggi
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive
LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. Bonds made with LOCTITE ABLESTIK 8-2 can withstand continuous exposure @ 150 °C and intermittent exposure @ 200°C.
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Informazioni tecniche
| Applicazioni | Die attach |
| Numero dei componenti | Monocomponente |
| Resistenza al taglio, Alluminio | 2300.0 psi |
| Schema di polimerizzazione, @ 95.0 °C | 1.5 ora |
| Temperatura di stoccaggio | -40.0 - 25.0 °C |
LOCTITE® ABLESTIK 8-2
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive