LOCTITE® ABLESTIK 8-2

Značajke i prednosti

LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive
LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. Bonds made with LOCTITE ABLESTIK 8-2 can withstand continuous exposure @ 150 °C and intermittent exposure @ 200°C.
Dodatne informacije

Tehnički podaci

Broj komponenti 1 dio
Primjene Ukalupljeno
Skladišna temperatura -40.0 - 25.0 °C
Snaga smicanja, Aluminij 2300.0 psi
Zakaži stvrdnjavanje, @ 95.0 °C 1.5 h