LOCTITE® ABLESTIK 8-2

Характеристики и ползи

LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive
LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. Bonds made with LOCTITE ABLESTIK 8-2 can withstand continuous exposure @ 150 °C and intermittent exposure @ 200°C.
Описание

Техническа информация

Брой компоненти 1 Част
Приложения Закрепване на кристали
Температура на съхранение -40.0 - 25.0 °C
Характеристика на втвърдяване, @ 95.0 °C 1.5 ч.
Якост на срязване, Алуминий 2300.0 psi