LOCTITE® ABLESTIK 8-2

Características y Ventajas

LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive
LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. Bonds made with LOCTITE ABLESTIK 8-2 can withstand continuous exposure @ 150 °C and intermittent exposure @ 200°C.
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Información técnica

Aplicaciones Unión
Número de componentes Monocomponente
Programa de curado, @ 95.0 °C 1.5 h
Resistencia al corte, Aluminio 2300.0 psi
Temperatura de almacenaje -40.0 - 25.0 °C