LOCTITE® ABLESTIK 8-2
Características y Ventajas
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive
LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. Bonds made with LOCTITE ABLESTIK 8-2 can withstand continuous exposure @ 150 °C and intermittent exposure @ 200°C.
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Información técnica
| Aplicaciones | Unión |
| Número de componentes | Monocomponente |
| Programa de curado, @ 95.0 °C | 1.5 h |
| Resistencia al corte, Aluminio | 2300.0 psi |
| Temperatura de almacenaje | -40.0 - 25.0 °C |
LOCTITE® ABLESTIK 8-2
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive