LOCTITE® ABLESTIK 8-2
Features and Benefits
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive
LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. Bonds made with LOCTITE ABLESTIK 8-2 can withstand continuous exposure @ 150 °C and intermittent exposure @ 200°C.
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Technical Information
| Applications | Die attach |
| Cure schedule, @ 95.0 °C | 1.5 hr. |
| Number of components | 1 part |
| Shear strength, Aluminum | 2300.0 psi |
| Storage temperature | -40.0 - 25.0 °C |
LOCTITE® ABLESTIK 8-2
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive