LOCTITE® ABLESTIK QMI519LB
Conosciuto come QMI519LB (20G)
Caratteristiche e vantaggi
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive
LOCTITE® ABLESTIK QMI519LB silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
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Informazioni tecniche
| Applicazioni | Die attach |
| Coefficiente di espansione termica (CTE) | 40.0 ppm/°C |
| Contenuto ionico estraibile, Cloruro (CI-) | 19.0 ppm |
| Contenuto ionico estraibile, Potassio (K+) | 19.0 ppm |
| Contenuto ionico estraibile, Sodio (Na+) | 19.0 ppm |
| Resistenza al taglio matrice temperatura ambiente, 2 x 2 mm Si die on Au leadframe | 15.0 kg-f |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
LOCTITE® ABLESTIK QMI519LB
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive