LOCTITE® ABLESTIK QMI519LB
U svojstvu QMI519LB (20G)
Značajke i prednosti
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive
LOCTITE® ABLESTIK QMI519LB silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
Dodatne informacije
Dokumenti i preuzimanja
Tražite list s tehničkim podacima ili list sa sigurnosnim podacima na drugom jeziku?
Tehnički podaci
| Izvlačivi jonski sadržaj, Kalij (K+) | 19.0 ppm |
| Izvlačivi jonski sadržaj, Klorid (CI-) | 19.0 ppm |
| Izvlačivi jonski sadržaj, Natrij (Na+) | 19.0 ppm |
| Koeficijent toplinske ekspanzije (CTE) | 40.0 ppm/°C |
| Primjene | Ukalupljeno |
| Snaga smicanja u kalupu RT, 2 x 2 mm Si die on Au leadframe | 15.0 kg-f |
| Tip stvrdnjavanja | Toplinsko stvrdnjavanje |
LOCTITE® ABLESTIK QMI519LB
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive