LOCTITE® ABLESTIK QMI519LB
Zināms kā QMI519LB (20G)
Iezīmes un ieguvumi
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive
LOCTITE® ABLESTIK QMI519LB silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
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Tehniskā informācija
| Iegūstamais jonu saturs, Hlorīds (CI-) | 19.0 ppm |
| Iegūstamais jonu saturs, Kālijs (K +) | 19.0 ppm |
| Iegūstamais jonu saturs, Nātrijs (Na +) | 19.0 ppm |
| Pielietojumi | Spiedoga pievienošana |
| RT spiedoga bīdes izturība, 2 x 2 mm Si die on Au leadframe | 15.0 kg-f |
| Sacietināšanas veids | Sacietināšana karsējot |
| Termiskās izplešanās koeficients (CTE) | 40.0 ppm/°C |
LOCTITE® ABLESTIK QMI519LB
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive