LOCTITE® ABLESTIK QMI519LB
Poznat kao QMI519LB (20G)
Elementi i pogodnosti
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive
LOCTITE® ABLESTIK QMI519LB silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
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Dokumenti i preuzimanja
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Tehnički podaci
| Jonski sadržaj koji se izvlači, Hlorid (Cl-) | 19.0 ppm |
| Jonski sadržaj koji se izvlači, Kalijum (K+) | 19.0 ppm |
| Jonski sadržaj koji se izvlači, Natrijum (Na+) | 19.0 ppm |
| Koeficijent toplotnog širenja (CTE) | 40.0 ppm/°C |
| Primene | Dodavanje boje |
| Sila smicanja RT kalupa, 2 x 2 mm Si die on Au leadframe | 15.0 kg-f |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
LOCTITE® ABLESTIK QMI519LB
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive