Advancements In Packaging Technology This paper will review how materials suppliers have invested significant resources to deliver market-ready materials aligned with this renewed emphasis on packaging technology development. Read More
Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications This paper compares the performance of an electrically conductive film adhesive widely used over the last twenty years in the electronics industry with that of a newly developed film designed to provide greater resistance to environmental exposure. Read More
Electrically Conductive Adhesives as Cell Interconnection Material in Shingled Module Technology Correct electrically conductive adhesives in combination with an accurate stringing assembly tool, offers a great potential for shingled module technology Read More
High-Reliability Meets Pb-free and Halogen-Free Working with a consortium of partners, Henkel has developed a new high reliability alloy called 90iSC, which has a melting point equivalent to standard SAC alloys and is capable of operating at high temperatures. Read More
Whitepaper: Pushing Beyond the Status Quo New lead-free solder paste offers the ultimate in performance and versatility. Read More
Solder Materials Science Gets Small Smaller devices, or rather extreme miniaturization, are arguably the industries "biggest" challenge to date. Read More
Whitepaper: Beyond Thermal Grease - Enhancing Thermal Performance and Reliability Power electronics based on silicon devices must operate below 125°C and IGBTs under 150°C. Future SiC devices could extend this to 200°C. Thermal management of power electronics requires interfacing the package to a heat sink using a thermal interface material (TIM). Read More
Whitepaper: Waterproof Sealant for Camera Modules Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone on the path to fully waterproofed smartphone and wearable devices. Read More
