White Papers and Technical Papers

Skip to content

Trends. News. Perspective.

Our White Papers and Technical Papers

Undressing Wearables: Electronic Materials are Essential to Function and Reliability

Henkel has developed extremely capable electronics materials that allow for high-volume processability...

Read More
Tombstoning Reduction via Phased-reflow Soldering Technical Article

This technical article details a drop-in replacement for standard lead alloys that virtually eliminates...

Read More
Temperature Stable Solder Paste Transforming Industry Mindset

LOCTITE® GC 10 — the market’s first-ever temperature stable solder paste — offers the unprecedented...

Read More
Personal Identity Verification Made Possible by Advanced Materials

Henkel has developed a comprehensive portfolio of products to address all of the demands of fingerprint...

Read More
Customizable Silicone Materials for Advanced MEMS Performance

Henkel has developed a customizable silicone platform that allows for modification of key properties...

Read More
Eliminating Mid-Chip Solder Balls: A Practical Guide to Understanding and Doing Away with this Common Defect

In this technical article, Henkel presents its findings on the relationship among component size and...

Read More
Whitepaper: Beyond Thermal Grease - Enhancing Thermal Performance and Reliability

Power electronics based on silicon devices must operate below 125°C and IGBTs under 150°C. Future ...

Read More
Whitepaper: Waterproof Sealant for Camera Modules

Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone...

Read More
Whitepaper: First-Ever Temperature Stable Solder Paste Unveiled

Henkel develops a lead-free, zero halogen solder paste that is stable at 26.5°C for one year, and ...

Read More

View All Insights