Henkel has developed extremely capable electronics materials that allow for high-volume processability, adaptability to manufacturing dynamics and miniaturized designs, as well as delivery of robust device protection against multiple environmental factors for the wearables market.

This technical article details a drop-in replacement for standard lead alloys that virtually eliminates tombstoning. (Source: SMT).

LOCTITE^® GC 10 — the market’s first-ever temperature stable solder paste — offers the unprecedented ability to ship the solder material via standard shipping and without any cold-packing requirements.

Henkel has developed a comprehensive portfolio of products to address all of the demands of fingerprint sensor manufacture — the fastest growing contact biometrics market.

Henkel has developed a customizable silicone platform that allows for modification of key properties such as rheology, modulus and color, with a wide process window during material application, ensuring robust function and better long-term reliability.

In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling.

Power electronics based on silicon devices must operate below 125°C and IGBTs under 150°C. Future SiC devices could extend this to 200°C. Thermal management of power electronics requires interfacing the package to a heat sink using a thermal interface material (TIM).

Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone on the path to fully waterproofed smartphone and wearable devices.

Henkel develops a lead-free, zero halogen solder paste that is stable at 26.5°C for one year, and at 40°C for one month.