White Papers and Technical Papers - Henkel Adhesives

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Our White Papers and Technical Papers

Electrically Conductive Adhesives as Cell Interconnection Material in Shingled Module Technology

Correct electrically conductive adhesives in combination with an accurate stringing assembly tool, offers a great potential for shingled module technology

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Whitepaper: Reliability that Sticks - Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format

Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format

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Whitepaper: Epoxy Flux Technology

Designed to offer process efficiency, epoxy flux underfills deliver a fluxing component that facilitates solder joint formation as well as an epoxy system that offers added device protection by encapsulating individual bumps.

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No Need For Sour Grapes

New Solder Paste Formulation Technology Resolves Graping Problems

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Whitepaper: Lead-Free for High-reliability and High-Temperature Applications

Recognizing the challenges, specialists across industry, material suppliers and the academic community set out to develop an alloy that could meet or exceed the high-temperature, high-reliability requirements necessary for automotive and military applications.

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Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications

This paper compares the performance of an electrically conductive film adhesive widely used over the last twenty years in the electronics industry with that of a newly developed film designed to provide greater resistance to environmental exposure.

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Undressing Wearables: Electronic Materials are Essential to Function and Reliability

Henkel has developed extremely capable electronics materials that allow for high-volume processability, adaptability to manufacturing dynamics and miniaturized designs, as well as delivery of robust device protection against multiple environmental factors for the wearables market.

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MEMS Need Comprehensive, Market-Ready Solutions

Consumer and automotive markets hold the answer for now, but other market sectors such as medical are also beginning to incorporate MEMS devices.

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Tombstoning Reduction via Phased-reflow Soldering Technical Article

This technical article details a drop-in replacement for standard lead alloys that virtually eliminates tombstoning. (Source: SMT).

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