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Get first-hand in-depth knowledge on food safety topics
Download Henkel's automotive white papers on adaptable, no-compromise material solutions
Download Henkel's presentation on Next Generation Metal Pretreatment for increased lightweighting, sustainability and more.
Thermal management of power electronics, whether power supplies or power components, requires interfacing the package to a heat sink using a thermal interface material (TIM). Traditionally used thermal greases provide good end of line performance but they can degrade.
New thermal gel solutions for Advanced Driver-Assistance Systems (ADAS) – covering cameras, radars and light detection.
Download Henkel's white paper on how design innovation enhances battery pack protection in this joint study by Henkel and RLE International.
Download Henkel's white paper on the use of structural tapes and patches to stiffen body panels on a variety of metal types.
Thermally conductive adhesives provide many advantages over traditional mechanical fastening techniques.
When QFN and other bottom-terminated devices are soldered using solder paste at atmospheric pressure, some voiding is always observed. The process of void formation during reflow is dynamic; voids, primarily formed from volatilized flux materials and soldering reaction products, grow, coalesce and then vent at the margins of the solder joint while the solder is molten.