Explore Chemistry Solutions for Next Generation Vehicles Download Henkel's automotive white papers on adaptable, no-compromise material solutions Read More
Thermal Gel Solutions for Advanced Driver Assistance Systems (ADAS) New thermal gel solutions for Advanced Driver-Assistance Systems (ADAS) – covering cameras, radars and light detection. Read More
Battery Crash Protection Using Hybrid Structural Parts Download Henkel's white paper on how design innovation enhances battery pack protection in this joint study by Henkel and RLE International. Read More
Enabling Lightweight Design with Tapes & Patches Download Henkel's white paper on the use of structural tapes and patches to stiffen body panels on a variety of metal types. Read More
Engineering Adhesive Solutions for Next Generation Structural Bonding Download Henkel's white paper on optimizing structural adhesives for next generation vehicle design and application Read More
Thermally Conductive Liquid Materials for Electronics Packaging Electronics packaging has utilized one-part and two-part liquid adhesives and sealants for many years. Solid thermal interface pads or sheets have also been widely used in electronics applications. Read More
Fracture Toughness of Thermally Conductive Adhesives Thermally conductive adhesives provide many advantages over traditional mechanical fastening techniques. Read More
The Influence of Aspects of Solder Paste Formulation and Soldering Process Factors on Voiding Under Large QFN Devices When QFN and other bottom-terminated devices are soldered using solder paste at atmospheric pressure, some voiding is always observed. The process of void formation during reflow is dynamic; voids, primarily formed from volatilized flux materials and soldering reaction products, grow, coalesce and then vent at the margins of the solder joint while the solder is molten. Read More
