Optical transceivers, switches and components are the engines of expansive data networks for metro, long haul, sub-sea and data center interconnect (DCI). Cost-effective and high-speed capable, optical devices have transformed in recent years, becoming smaller in size, using less power while increasing data throughput.

The coming era of 5G mobile communications has users excited about the possibilities and broadband systems designers and manufacturers a bit nervous about the realities.

Telecom and datacom systems, once considered distinct ecosystems, are now interdependent networks of wireless devices and cloud hyperscale data services.

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To manage the greater data bandwidth needs inherent with 4k rich media streaming, machine learning, data mining, and analytics, next-generation hyper-scale and cloud-scale datacenters are transitioning to the 400 gigabit ethernet (GbE) standard.

This paper will review how materials suppliers have invested significant resources to deliver market-ready materials aligned with this renewed emphasis on packaging technology development.

Power electronics based on silicon devices must operate below 125°C and IGBTs under 150°C. Future SiC devices could extend this to 200°C. Thermal management of power electronics requires interfacing the package to a heat sink using a thermal interface material (TIM).

Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone on the path to fully waterproofed smartphone and wearable devices.

Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format