Eliminating Mid-Chip Solder Balls: A Practical Guide to Understanding and Doing Away with this Common Defect In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling. Read More
2018-05-24 Whitepaper: High Power Density Applications Enabled by New Thermal Interface Material Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry platform with unique filler technology, created for the increasing requirement for lower-stress materials for next-generation high power density devices. Read More
Whitepaper: Waterproof Sealant for Camera Modules Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone on the path to fully waterproofed smartphone and wearable devices. Read More
Tombstoning Reduction via Phased-reflow Soldering Technical Article This technical article details a drop-in replacement for standard lead alloys that virtually eliminates tombstoning. (Source: SMT). Read More
Undressing Wearables: Electronic Materials are Essential to Function and Reliability Henkel has developed extremely capable electronics materials that allow for high-volume processability, adaptability to manufacturing dynamics and miniaturized designs, as well as delivery of robust device protection against multiple environmental factors for the wearables market. Read More
Customizable Silicone Materials for Advanced MEMS Performance Henkel has developed a customizable silicone platform that allows for modification of key properties such as rheology, modulus and color, with a wide process window during material application, ensuring robust function and better long-term reliability. Read More
Whitepaper: Beyond Thermal Grease - Enhancing Thermal Performance and Reliability Power electronics based on silicon devices must operate below 125°C and IGBTs under 150°C. Future SiC devices could extend this to 200°C. Thermal management of power electronics requires interfacing the package to a heat sink using a thermal interface material (TIM). Read More