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Thermal management of power electronics, whether power supplies or power components, requires interfacing the package to a heat sink using a thermal interface material (TIM). Traditionally used thermal greases provide good end of line performance but they can degrade.

When QFN and other bottom-terminated devices are soldered using solder paste at atmospheric pressure, some voiding is always observed. The process of void formation during reflow is dynamic; voids, primarily formed from volatilized flux materials and soldering reaction products, grow, coalesce and then vent at the margins of the solder joint while the solder is molten.

Thermally conductive adhesives provide many advantages over traditional mechanical fastening techniques.

Electronics packaging has utilized one-part and two-part liquid adhesives and sealants for many years. Solid thermal interface pads or sheets have also been widely used in electronics applications.

Correct electrically conductive adhesives in combination with an accurate stringing assembly tool, offers a great potential for shingled module technology