Explore Chemistry Solutions for Next Generation Vehicles Download Henkel's automotive white papers on adaptable, no-compromise material solutions Read More
The Influence of Aspects of Solder Paste Formulation and Soldering Process Factors on Voiding Under Large QFN Devices When QFN and other bottom-terminated devices are soldered using solder paste at atmospheric pressure, some voiding is always observed. The process of void formation during reflow is dynamic; voids, primarily formed from volatilized flux materials and soldering reaction products, grow, coalesce and then vent at the margins of the solder joint while the solder is molten. Read More
Fracture Toughness of Thermally Conductive Adhesives Thermally conductive adhesives provide many advantages over traditional mechanical fastening techniques. Read More
Thermally Conductive Liquid Materials for Electronics Packaging Electronics packaging has utilized one-part and two-part liquid adhesives and sealants for many years. Solid thermal interface pads or sheets have also been widely used in electronics applications. Read More
Electrically Conductive Adhesives as Cell Interconnection Material in Shingled Module Technology Correct electrically conductive adhesives in combination with an accurate stringing assembly tool, offers a great potential for shingled module technology Read More
Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications This paper compares the performance of an electrically conductive film adhesive widely used over the last twenty years in the electronics industry with that of a newly developed film designed to provide greater resistance to environmental exposure. Read More
High-Performance Conductive Film Technology for Large Die Automotive Applications: MSL and Board-Level Exposed Pad Performance This article will focus on reliability testing for conductive Die Attach Film (cDAF) technology, specifically on die applications ranging from 1x1 mm2 to 10x10 mm2. Read More
