Correct electrically conductive adhesives in combination with an accurate stringing assembly tool, offers a great potential for shingled module technology

This article will focus on reliability testing for conductive Die Attach Film (cDAF) technology, specifically on die applications ranging from 1x1 mm2 to 10x10 mm2.

Consumer and automotive markets hold the answer for now, but other market sectors such as medical are also beginning to incorporate MEMS devices.

This paper will review how materials suppliers have invested significant resources to deliver market-ready materials aligned with this renewed emphasis on packaging technology development.

Mechanical stress in FC assemblies continues to be a significant problem for reliability and the assembly of a flat component to the next board-level assembly.

Recognizing the challenges, specialists across industry, material suppliers and the academic community set out to develop an alloy that could meet or exceed the high-temperature, high-reliability requirements necessary for automotive and military applications.

Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format

Working with a consortium of partners, Henkel has developed a new high reliability alloy called 90iSC, which has a melting point equivalent to standard SAC alloys and is capable of operating at high temperatures.