Optical transceivers, switches and components are the engines of expansive data networks for metro, long haul, sub-sea and data center interconnect (DCI). Cost-effective and high-speed capable, optical devices have transformed in recent years, becoming smaller in size, using less power while increasing data throughput.

The coming era of 5G mobile communications has users excited about the possibilities and broadband systems designers and manufacturers a bit nervous about the realities.

Telecom and datacom systems, once considered distinct ecosystems, are now interdependent networks of wireless devices and cloud hyperscale data services.

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To manage the greater data bandwidth needs inherent with 4k rich media streaming, machine learning, data mining, and analytics, next-generation hyper-scale and cloud-scale datacenters are transitioning to the 400 gigabit ethernet (GbE) standard.

This paper will review how materials suppliers have invested significant resources to deliver market-ready materials aligned with this renewed emphasis on packaging technology development.

New Solder Paste Formulation Technology Resolves Graping Problems

Working with a consortium of partners, Henkel has developed a new high reliability alloy called 90iSC, which has a melting point equivalent to standard SAC alloys and is capable of operating at high temperatures.

Correct electrically conductive adhesives in combination with an accurate stringing assembly tool, offers a great potential for shingled module technology