Electrically Conductive Adhesives as Cell Interconnection Material in Shingled Module Technology Correct electrically conductive adhesives in combination with an accurate stringing assembly tool, offers a great potential for shingled module technology Read More
Whitepaper: Reliability that Sticks - Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format Read More
Whitepaper: Epoxy Flux Technology Designed to offer process efficiency, epoxy flux underfills deliver a fluxing component that facilitates solder joint formation as well as an epoxy system that offers added device protection by encapsulating individual bumps. Read More
Whitepaper: Lead-Free for High-reliability and High-Temperature Applications Recognizing the challenges, specialists across industry, material suppliers and the academic community set out to develop an alloy that could meet or exceed the high-temperature, high-reliability requirements necessary for automotive and military applications. Read More
Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications This paper compares the performance of an electrically conductive film adhesive widely used over the last twenty years in the electronics industry with that of a newly developed film designed to provide greater resistance to environmental exposure. Read More
Undressing Wearables: Electronic Materials are Essential to Function and Reliability Henkel has developed extremely capable electronics materials that allow for high-volume processability, adaptability to manufacturing dynamics and miniaturized designs, as well as delivery of robust device protection against multiple environmental factors for the wearables market. Read More
MEMS Need Comprehensive, Market-Ready Solutions Consumer and automotive markets hold the answer for now, but other market sectors such as medical are also beginning to incorporate MEMS devices. Read More
Tombstoning Reduction via Phased-reflow Soldering Technical Article This technical article details a drop-in replacement for standard lead alloys that virtually eliminates tombstoning. (Source: SMT). Read More
