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Download Henkel's automotive white papers on adaptable, no-compromise material solutions
New thermal gel solutions for Advanced Driver-Assistance Systems (ADAS) – covering cameras, radars and light detection.
Download Henkel's white paper on how design innovation enhances battery pack protection in this joint study by Henkel and RLE International.
Download Henkel's white paper on the use of structural tapes and patches to stiffen body panels on a variety of metal types.
Download Henkel's white paper on optimizing structural adhesives for next generation vehicle design and application
When QFN and other bottom-terminated devices are soldered using solder paste at atmospheric pressure, some voiding is always observed. The process of void formation during reflow is dynamic; voids, primarily formed from volatilized flux materials and soldering reaction products, grow, coalesce and then vent at the margins of the solder joint while the solder is molten.
Thermally conductive adhesives provide many advantages over traditional mechanical fastening techniques.
Electronics packaging has utilized one-part and two-part liquid adhesives and sealants for many years. Solid thermal interface pads or sheets have also been widely used in electronics applications.