In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling.

Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry platform with unique filler technology, created for the increasing requirement for lower-stress materials for next-generation high power density devices.

Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone on the path to fully waterproofed smartphone and wearable devices.

This paper will review how materials suppliers have invested significant resources to deliver market-ready materials aligned with this renewed emphasis on packaging technology development.

This technical article details a drop-in replacement for standard lead alloys that virtually eliminates tombstoning. (Source: SMT).

Henkel has developed extremely capable electronics materials that allow for high-volume processability, adaptability to manufacturing dynamics and miniaturized designs, as well as delivery of robust device protection against multiple environmental factors for the wearables market.

Henkel has developed a customizable silicone platform that allows for modification of key properties such as rheology, modulus and color, with a wide process window during material application, ensuring robust function and better long-term reliability.

Power electronics based on silicon devices must operate below 125°C and IGBTs under 150°C. Future SiC devices could extend this to 200°C. Thermal management of power electronics requires interfacing the package to a heat sink using a thermal interface material (TIM).

Henkel develops a lead-free, zero halogen solder paste that is stable at 26.5°C for one year, and at 40°C for one month.