White Papers and Technical Papers

Skip to content

Trends. News. Perspective.

Our White Papers and Technical Papers

Eliminating Mid-Chip Solder Balls: A Practical Guide to Understanding and Doing Away with this Common Defect

In this technical article, Henkel presents its findings on the relationship among component size and...

Read More
2018-05-24

Whitepaper: High Power Density Applications Enabled by New Thermal Interface Material

Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry...

Read More
Whitepaper: Waterproof Sealant for Camera Modules

Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone...

Read More
Advancements In Packaging Technology

This paper will review how materials suppliers have invested significant resources to deliver market-ready...

Read More
Tombstoning Reduction via Phased-reflow Soldering Technical Article

This technical article details a drop-in replacement for standard lead alloys that virtually eliminates...

Read More
Undressing Wearables: Electronic Materials are Essential to Function and Reliability

Henkel has developed extremely capable electronics materials that allow for high-volume processability...

Read More
Customizable Silicone Materials for Advanced MEMS Performance

Henkel has developed a customizable silicone platform that allows for modification of key properties...

Read More
Whitepaper: Beyond Thermal Grease - Enhancing Thermal Performance and Reliability

Power electronics based on silicon devices must operate below 125°C and IGBTs under 150°C. Future ...

Read More
Whitepaper: First-Ever Temperature Stable Solder Paste Unveiled

Henkel develops a lead-free, zero halogen solder paste that is stable at 26.5°C for one year, and ...

Read More

View All Insights