Correct electrically conductive adhesives in combination with an accurate stringing assembly tool, offers a great potential for shingled module technology

Designed to offer process efficiency, epoxy flux underfills deliver a fluxing component that facilitates solder joint formation as well as an epoxy system that offers added device protection by encapsulating individual bumps.

Recognizing the challenges, specialists across industry, material suppliers and the academic community set out to develop an alloy that could meet or exceed the high-temperature, high-reliability requirements necessary for automotive and military applications.

Henkel has developed extremely capable electronics materials that allow for high-volume processability, adaptability to manufacturing dynamics and miniaturized designs, as well as delivery of robust device protection against multiple environmental factors for the wearables market.

Consumer and automotive markets hold the answer for now, but other market sectors such as medical are also beginning to incorporate MEMS devices.

This technical article details a drop-in replacement for standard lead alloys that virtually eliminates tombstoning. (Source: SMT).