Whitepaper: Waterproof Sealant for Camera Modules Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone on the path to fully waterproofed smartphone and wearable devices. Read More
Customizable Silicone Materials for Advanced MEMS Performance Henkel has developed a customizable silicone platform that allows for modification of key properties such as rheology, modulus and color, with a wide process window during material application, ensuring robust function and better long-term reliability. Read More
Whitepaper: First-Ever Temperature Stable Solder Paste Unveiled Henkel develops a lead-free, zero halogen solder paste that is stable at 26.5°C for one year, and at 40°C for one month. Read More
Personal Identity Verification Made Possible by Advanced Materials Henkel has developed a comprehensive portfolio of products to address all of the demands of fingerprint sensor manufacture — the fastest growing contact biometrics market. Read More
High-Reliability Meets Pb-free and Halogen-Free Working with a consortium of partners, Henkel has developed a new high reliability alloy called 90iSC, which has a melting point equivalent to standard SAC alloys and is capable of operating at high temperatures. Read More
Solder Materials Science Gets Small Smaller devices, or rather extreme miniaturization, are arguably the industries "biggest" challenge to date. Read More
Whitepaper: Reliability that Sticks - Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format Read More
Flip-Chip Process Improvements for Low Warpage Mechanical stress in FC assemblies continues to be a significant problem for reliability and the assembly of a flat component to the next board-level assembly. Read More
Whitepaper: Epoxy Flux Technology Designed to offer process efficiency, epoxy flux underfills deliver a fluxing component that facilitates solder joint formation as well as an epoxy system that offers added device protection by encapsulating individual bumps. Read More