Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone on the path to fully waterproofed smartphone and wearable devices.

Henkel has developed a customizable silicone platform that allows for modification of key properties such as rheology, modulus and color, with a wide process window during material application, ensuring robust function and better long-term reliability.

Henkel develops a lead-free, zero halogen solder paste that is stable at 26.5°C for one year, and at 40°C for one month.

Henkel has developed a comprehensive portfolio of products to address all of the demands of fingerprint sensor manufacture — the fastest growing contact biometrics market.

Working with a consortium of partners, Henkel has developed a new high reliability alloy called 90iSC, which has a melting point equivalent to standard SAC alloys and is capable of operating at high temperatures.

Smaller devices, or rather extreme miniaturization, are arguably the industries "biggest" challenge to date.

Mechanical stress in FC assemblies continues to be a significant problem for reliability and the assembly of a flat component to the next board-level assembly.

Designed to offer process efficiency, epoxy flux underfills deliver a fluxing component that facilitates solder joint formation as well as an epoxy system that offers added device protection by encapsulating individual bumps.