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Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications

This paper compares the performance of an electrically conductive film adhesive widely used over the...

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Tombstoning Reduction via Phased-reflow Soldering Technical Article

This technical article details a drop-in replacement for standard lead alloys that virtually eliminates...

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Whitepaper: Waterproof Sealant for Camera Modules

Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone...

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2018-05-24

Whitepaper: High Power Density Applications Enabled by New Thermal Interface Material

Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry...

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Eliminating Mid-Chip Solder Balls: A Practical Guide to Understanding and Doing Away with this Common Defect

In this technical article, Henkel presents its findings on the relationship among component size and...

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Whitepaper: First-Ever Temperature Stable Solder Paste Unveiled

Henkel develops a lead-free, zero halogen solder paste that is stable at 26.5°C for one year, and ...

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Temperature Stable Solder Paste Transforming Industry Mindset

LOCTITE GC 10 — the market’s first-ever temperature stable solder paste — offers the unprecedented...

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Whitepaper: Beyond Thermal Grease - Enhancing Thermal Performance and Reliability

Power electronics based on silicon devices must operate below 125°C and IGBTs under 150°C. Future ...

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Undressing Wearables: Electronic Materials are Essential to Function and Reliability

Henkel has developed extremely capable electronics materials that allow for high-volume processability...

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