White Papers and Technical Papers - Henkel Adhesives

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Our White Papers and Technical Papers

Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications

This paper compares the performance of an electrically conductive film adhesive widely used over the last twenty years in the electronics industry with that of a newly developed film designed to provide greater resistance to environmental exposure.

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Whitepaper: Waterproof Sealant for Camera Modules

Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone on the path to fully waterproofed smartphone and wearable devices.

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Whitepaper: First-Ever Temperature Stable Solder Paste Unveiled

Henkel develops a lead-free, zero halogen solder paste that is stable at 26.5°C for one year, and at 40°C for one month.

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Whitepaper: Reliability that Sticks - Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format

Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format

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Solder Materials Science Gets Small

Smaller devices, or rather extreme miniaturization, are arguably the industries "biggest" challenge to date.

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High-Reliability Meets Pb-free and Halogen-Free

Working with a consortium of partners, Henkel has developed a new high reliability alloy called 90iSC, which has a melting point equivalent to standard SAC alloys and is capable of operating at high temperatures.

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Personal Identity Verification Made Possible by Advanced Materials

Henkel has developed a comprehensive portfolio of products to address all of the demands of fingerprint sensor manufacture — the fastest growing contact biometrics market.

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Whitepaper: Epoxy Flux Technology

Designed to offer process efficiency, epoxy flux underfills deliver a fluxing component that facilitates solder joint formation as well as an epoxy system that offers added device protection by encapsulating individual bumps.

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Flip-Chip Process Improvements for Low Warpage

Mechanical stress in FC assemblies continues to be a significant problem for reliability and the assembly of a flat component to the next board-level assembly.

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