This technical article details a drop-in replacement for standard lead alloys that virtually eliminates tombstoning. (Source: SMT).

Mechanical stress in FC assemblies continues to be a significant problem for reliability and the assembly of a flat component to the next board-level assembly.

Smaller devices, or rather extreme miniaturization, are arguably the industries "biggest" challenge to date.

In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling.

Working with a consortium of partners, Henkel has developed a new high reliability alloy called 90iSC, which has a melting point equivalent to standard SAC alloys and is capable of operating at high temperatures.

Henkel has developed extremely capable electronics materials that allow for high-volume processability, adaptability to manufacturing dynamics and miniaturized designs, as well as delivery of robust device protection against multiple environmental factors for the wearables market.

Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone on the path to fully waterproofed smartphone and wearable devices.

Henkel has developed a new die attach formulation designed for exceptionally fast processing and compatibility with the most widely used encapsulants in the market.