BERGQUIST® GAP PAD TGP 1500

Features and Benefits

Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
  • Unreinforced construction for additional compliancy
  • Thermal conductivity: 1.5 W/m-K
  • UL94 V-0 compliant
  • Reworkable
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Technical Information

Color Black
Operating temperature -60.0 - 200.0 °C
Standard thickness 0.508 - 5.08 mm
Thermal conductivity 1.5 W/mK
Young's modulus, ASTM D575 310.0 KPa (45.0 psi )