BERGQUIST® GAP PAD® TGP 1500
Conhecido como Gap Pad® 1500
Características e Vantagens
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
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Informação Técnica
| Condutividade térmica | 1.5 W/mK |
| Cor | Negro |
| Espessura padrão | 0.508 - 5.08 mm |
| Módulo de Young, ASTM D575 | 310.0 KPa (45.0 psi ) |
| Temperatura de operação | -60.0 - 200.0 °C |
BERGQUIST® GAP PAD® TGP 1500
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.