BERGQUIST® GAP PAD TGP 1500

Conhecido como Gap Pad® 1500

Características e Benefícios

Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
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Informação Técnica

Condutividade térmica 1.5 W/mK
Cor Preto
Espessura padrão 0.508 - 5.08 mm
Módulo de Young, ASTM D575 310.0 KPa (45.0 psi )
Temperatura de operação -60.0 - 200.0 °C