BERGQUIST® GAP PAD® TGP 1500

Žinoma kaip Gap Pad® 1500

Savybės ir privalumai

Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
Aprašymas

Techniniai duomenys

Darbinė temperatūra -60.0 - 200.0 °C
Spalva Juoda
Standartinis storis 0.508 - 5.08 mm
Šilumos laidumas 1.5 W/mK
„Young“ modulis, ASTM D575 310.0 KPa (45.0 psi )