LOCTITE® ABLESTIK ABP 8065T
Caratteristiche e vantaggi
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
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Informazioni tecniche
| Applicazioni | Die attach |
| Coefficiente di espansione termica (CTE) | 40.0 ppm/°C |
| Coefficiente di espansione termica (CTE), Above Tg | 146.0 ppm/°C |
| Conducibilità termica | 10.0 W/mK |
| Indice tixotropico | 6.0 |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
| Viscosità, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8065T
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive