LOCTITE® ABLESTIK ABP 8065T
Značajke i prednosti
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
Dodatne informacije
Dokumenti i preuzimanja
Tražite list s tehničkim podacima ili list sa sigurnosnim podacima na drugom jeziku?
Tehnički podaci
| Koeficijent toplinske ekspanzije (CTE) | 40.0 ppm/°C |
| Koeficijent toplinske ekspanzije (CTE), Above Tg | 146.0 ppm/°C |
| Primjene | Ukalupljeno |
| Tiksotropni indeks | 6.0 |
| Tip stvrdnjavanja | Toplinsko stvrdnjavanje |
| Toplinska vodljivost | 10.0 W/mK |
| Viskoznost, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8065T
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive