LOCTITE® ABLESTIK ABP 8065T
Vlastnosti a výhody
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Aplikácia | Pripevnenie formy |
| Koeficient tepelnej rozťažnosti (CTE) | 40.0 ppm/°C |
| Koeficient tepelnej rozťažnosti (CTE), Above Tg | 146.0 ppm/°C |
| Spôsob vytvrdzovania | Vytvrdzovanie teplom |
| Tepelná vodivosť | 10.0 W/mK |
| Tixotropný index | 6.0 |
| Viskozita, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8065T
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive