LOCTITE® ABLESTIK ABP 8065T

Features and Benefits

LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
  • Medium to high thermal conductivity
  • No channel void issue
  • High die shear strength
  • High electrical conductivity
Read More

Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 40.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 146.0 ppm/°C
Cure type Heat cure
Thermal conductivity 10.0 W/mK
Thixotropic index 6.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 9000.0 mPa·s (cP)