LOCTITE® ABLESTIK ABP 8065T
Features and Benefits
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
- Medium to high thermal conductivity
- No channel void issue
- High die shear strength
- High electrical conductivity
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 40.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 146.0 ppm/°C |
| Cure type | Heat cure |
| Thermal conductivity | 10.0 W/mK |
| Thixotropic index | 6.0 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9000.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 8065T
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive