LOCTITE® ABLESTIK 2030SC
Conosciuto come ABLEBOND 2030SC (45G)
Caratteristiche e vantaggi
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
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Informazioni tecniche
| Applicazioni | Die attach |
| Contenuto ionico estraibile, Cloruro (CI-) | 19.0 ppm |
| Contenuto ionico estraibile, Potassio (K+) | 4.0 ppm |
| Contenuto ionico estraibile, Sodio (Na+) | 29.0 ppm |
| Indice tixotropico | 4.6 |
| Modulo di trazione, @ 250.0 °C | 450.0 N/mm² (65000.0 psi ) |
| Resistenza al taglio matrice calda | 0.96 kg-f |
| Resistenza al taglio matrice temperatura ambiente, 2 x 2 mm Si die on Pd | 1.9 kg-f |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
LOCTITE® ABLESTIK 2030SC
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.